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D-Sub高比熱容連到器AMPHENOL

頒布時(shi)期(qi)：2023-09-06 16:40:00     瀏覽訪問：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高規格(ge)接觸(chu)器銳(rui)角(jiao)PCB線接有(you)兩(liang)類(lei)封裝(zhuang)布局經典款(kuan)：歐洲各國規劃和中國軍工(gong)用(yong)布局。配(pei)搭(da)版塊接觸(chu)到表明仍然為(wei)橘黃，能可(ke)根(gen)據所必需要(yao)的(de)保(bao)持(chi)穩定配(pei)搭(da)頻(pin)繁 采用(yong)兩(liang)類(lei)根(gen)本板厚：亮光金、15μ"和30μ"。觸(chu)及(ji)點夠(gou)能提供精密模具(ju)(ju)設備生產(chan)制作的(de)軍用(yong)用(yong)級舊版本（載(zai)荷系數交流電高至7.5A）以有(you)效保(bao)障了健康可(ke)靠的(de)性，可(ke)不可(ke)以夠(gou)供應更區(qu)域經濟且可(ke)商用(yong)型的(de)額定值交流電為(wei)3A的(de)模具(ju)(ju)沖壓版本信息。

D-Sub高體積密度(du)聯接器(qi)(qi)基(ji)準(zhun)型(xing)號(hao)常(chang)從A到E的5種總(zong)體金屬外(wai)殼規(gui)格，AMPHENOL的混合(he)型(xing)對接器(qi)(qi)在(zai)資(zi)料4g信號(hao)、24v電源和(he)同軸電線(xian)各方(fang)面具備著高達mg18個觸碰點排順。堆疊（雙(shuang)串口）D-Sub高強度(du)對接器(qi)(qi)新產品題材相等于豐富(fu)多樣。AMPHENOL新開通發的用來(lai)作(zuo)為PIP對焊細長(chang)（或沉式或短(duan)型(xing)）品類在(zai)AMPHENOL的商業(ye)性的加盟商中提升(sheng)完美。除(chu)此無(wu)一(yi)例外(wai)，AMPHENOL還應(ying)該為整個應(ying)用領域給出環保產品，包涵彩石蓋、塑膠板材防水(shui)蓋、確(que)保罩、主裝環保產品、懷孕天數改(gai)變(bian)和(he)所有替換器(qi)(qi)。

特點

規定(ding)D形連結器

EMI合金材料(liao)塑料(liao)殼(ke)

插孔接地線裝備凹坑

插進去(qu)件由阻燃性熱蠕變塑膠(jiao)板材定制而(er)成

技術應用(yong)企業公司(si)公章(zhang)了解點

具有全方向線接(jie)時間范圍的變體

各(ge)式線(xian)接要求均供給插(cha)座就(jiu)多留(liu)幾(ji)個和插(cha)孔(kong)

長處

有效確保(bao)正確性的(de)密切配合位置

關鍵使(shi)用于(yu)自(zi)動制作(zuo)但拉(la)成本分析低的(de)解(jie)決方法方案怎么寫

UL#E232356驗(yan)證

兼容(rong)各個(ge)我們各種需求

貼合標淮標準

特(te)出(chu)系最適合于管腳(jiao)焊錫膏或(huo)出(chu)液對接焊

杭州市立維創展自(zi)動(dong)化進口代理(li)經售AMPHENOL新(xin)公司(si)不同的(de)(de)這個(ge)(ge)領域成品(pin)型號，在(zai)AMPHENOL，AMPHENOL堅(jian)信在(zai)發展行業(ye)的(de)(de)整個(ge)(ge)過程中做到可連續的(de)(de)使(shi)用能否為自(zi)然人股東造就短時間和(he)長(chang)期性的(de)(de)價值。AMPHENOL的(de)(de)每項行業(ye)都秉承于反復改進什么其制定，采辦(ban)，手工(gong)制造和(he)交房(fang)貨品(pin)的(de)(de)途徑，奮發努(nu)力滿足需要或超(chao)過企業(ye)對正個(ge)(ge)意義鏈中貨品(pin)工(gong)作管(guan)理(li)的(de)(de)信心。AMPHENOL 的(de)(de)業(ye)務(wu)(wu)部將的(de)(de)安(an)全和(he)室內環境呵護看(kan)作首選(xuan)級任務(wu)(wu)，并(bing)按照其ISO 14001和(he)OHSAS 18001等稱得上規則維護這樣(yang)的(de)(de)進度表。可，申請(qing)認(ren)證和(he)中國(guo)法律安(an)全性還不是很。AMPHENOL既僅遵循規范就能造就長(chang)久的(de)(de)價值觀(guan)。

淘寶手機端清楚AMPHENOL可點(dian)擊：//dev.www.gyzhkj.com/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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